Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

ABSTRACT

There are provided a ceramic sheet product for a ceramic electronic component, a multilayer ceramic electronic component using the same, and a method of manufacturing the multilayer ceramic electronic component. The ceramic sheet product for a ceramic electronic component includes a ceramic layer; a metal layer formed on the ceramic layer; and metal nanostructures contacting the metal layer and protruding from the metal layer to an inner portion of the ceramic layer. With the multilayer ceramic electronic component using the ceramic sheet product for a ceramic electronic component, an interval between electrodes is reduced to thereby allow for the increase of capacitance, whereby a multilayer ceramic electronic component having high capacitance may be provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2011-0037261 filed on Apr. 21, 2011, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a ceramic sheet product for a ceramicelectronic component, a high capacitance multilayer ceramic electroniccomponent using the same, and a method of manufacturing the multilayerceramic electronic component.

2. Description of the Related Art

In accordance with the recent trend for the miniaturization ofelectronic products, the demand for multilayer ceramic electroniccomponents having a small size and large capacity has increased.Therefore, an attempt at thinning and multilayering dielectric layersand internal electrodes have been undertaken through various methods.Recently, as the thickness of the dielectric layer has been thinned,multilayer ceramic electronic components having an increased number ofstacked dielectric layers have been manufactured.

However, there is a need to efficiently design a structure between aceramic and an internal electrode layer through new technology in orderto manufacture a multilayer ceramic electronic component having largercapacitance.

In accordance with this demand, efforts for reducing an interval betweenelectrodes while simultaneously increasing a surface area of theelectrodes have been conducted to now.

SUMMARY OF THE INVENTION

An aspect of the present invention provides a ceramic sheet product fora ceramic electronic component, a high capacitance multilayer ceramicelectronic component using the same, and a method of manufacturing themultilayer ceramic electronic component.

According to an aspect of the present invention, there is provided aceramic sheet product for a ceramic electronic component, the ceramicsheet product including: a ceramic layer; a metal layer formed on theceramic layer; and metal nanostructures contacting the metal layer andprotruding from the metal layer to an inner portion of the ceramiclayer.

The metal nanostructures may have a height less than that of the ceramiclayer.

The metal nanostructures may be cylindrical and have a star shaped crosssection.

The metal nanostructures may be made of the same kind of material asthat of the metal layer.

According to another aspect of the present invention, there is provideda method of manufacturing a ceramic sheet product for a ceramicelectronic component, the method including: preparing metalnanostructures; transferring the metal nanostructures to a ceramic greensheet having a ceramic layer formed thereon so as to protrude to aninner portion of the ceramic layer; and forming a metal layer on theceramic green sheet so as to contact the metal nanostructures.

The metal nanostructures may have a height less than that of the ceramiclayer.

The preparing of metal nanostructures may include patterning a polymermatrix through a nanoimprinting method and growing the metalnanostructures.

The growing of the metal nanostructures may be performed by anelectrochemical method or a deposition method.

The metal nanostructures may be made of the same kind of material asthat of the metal layer.

According to another aspect of the present invention, there is provideda multilayer ceramic electronic component including: a ceramic bodyhaving a plurality of dielectric layers and a plurality of internalelectrode layers, alternately stacked therein; metal nanostructurescontacting the internal electrode layers and protruding from theinternal electrode layers to inner portions of the dielectric layers;and external electrodes formed on end surfaces of the ceramic body andelectrically connected to the internal electrodes.

The metal nanostructures may have a height less than that of thedielectric layers.

The metal nanostructures may be cylindrical, may have a star shapedcross section, and may be made of the same kind of material as that ofthe internal electrode layers.

According to another aspect of the present invention, there is provideda method of manufacturing a multilayer ceramic electronic component, themethod including: preparing metal nanostructures; transferring the metalnanostructures to a ceramic green sheet having a dielectric layer formedthereon so as to protrude to an inner portion of the dielectric layer;preparing an internal electrode layer on the ceramic green sheet so asto contact the metal nanostructures; forming a laminate by stackingseveral layers of the ceramic green sheet in which the dielectric layer,the internal electrode layer formed on the dielectric layer, and themetal nanostructures contacting the internal electrode layer andprotruding to the inner portion of the dielectric layer are formed;manufacturing a green chip by compressing and cutting the laminate; andmanufacturing a ceramic body by firing the green chip.

The nanostructures may have a height less than that of the dielectriclayer.

The preparing of the metal nanostructures may include patterning apolymer matrix through a nanoimprinting method and growing the metalnanostructures.

The growing of the metal nanostructures may be performed by anelectrochemical method or a deposition method.

The metal nanostructures may be made of the same kind of material asthat of the internal electrode layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a cross-sectional view schematically showing a ceramic sheetproduct for a ceramic electronic component according to an embodiment ofthe present invention;

FIG. 2 is a view showing a process of manufacturing a ceramic sheetproduct for a ceramic electronic component according to an embodiment ofthe present invention;

FIG. 3 is a flowchart showing a process of manufacturing a metalnanostructure according to an embodiment of the present invention;

FIG. 4A is a scanning electron microscope (SEM) photograph of a polymermatrix after a nano imprint lithography (NIL) process; and FIGS. 4B and4C are SEM photographs of metal nanostructures after the NIL process;

FIG. 5 is a perspective view schematically showing a multilayer ceramiccapacitor according to an embodiment of the present invention;

FIG. 6 is a cross-sectional view of the multilayer ceramic capacitortaken along line B-B′ of FIG. 5; and

FIG. 7 is a view showing a process of manufacturing a multilayer ceramiccapacitor according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The embodiments of the present invention may be modified in manydifferent forms and the scope of the invention should not be construedas being limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the concept of the invention to thoseskilled in the art. In the drawings, the shapes and dimensions ofelements may be exaggerated for clarity, and the same reference numeralswill be used throughout to designate the same or like components.

Embodiments of the present invention will now be described in detailwith reference to the accompanying drawings.

FIG. 1 is a cross-sectional view schematically showing a ceramic sheetproduct for a ceramic electronic component according to an embodiment ofthe present invention.

Referring to FIG. 1, a ceramic sheet product 10 for a ceramic electroniccomponent according to an embodiment of the present invention mayinclude a ceramic layer 1, a metal layer 2 formed on the ceramic layer1, and metal nanostructures 3 contacting the metal layer 2 andprotruding from the metal layer 2 to an inner portion of the ceramiclayer 1.

The ceramic sheet product 10 for a ceramic electronic componentaccording to an embodiment of the present invention, which is in a statebefore being used to manufacture a multilayer ceramic electroniccomponent, may be formed on a carrier film 4 to thereby be completed.

The ceramic layer 1 may be made of any material so long as it is agenerally used material, for example, barium titanate (BaTiO₃), or thelike, and may have a thickness of 2 μm or less.

The metal layer 2 may be made of at least one among silver (Ag), lead(Pb), platinum (Pt), nickel (Ni), copper (Cu) and the like or a mixtureof at least two thereof.

The metal layer 2 may have a thickness of 0.3 to 1.0 μm.

The ceramic sheet product 10 for a ceramic electronic componentaccording to an embodiment of the present invention may include themetal nanostructures 3 contacting the metal layer 2 and protruding fromthe metal layer 2 to the inner portion of the ceramic layer 1.

The metal nanostructure 3 may have variously changed heights accordingto an embodiment of the present invention and may have a height lessthan that of the ceramic layer 1.

In the case of stacking several layers of the ceramic sheet product,when the metal nanostructure has the same height as that of the ceramiclayer, it may contact a lower metal layer (not shown) contacting theceramic layer, thereby causing a short circuit. Therefore, the metalnanostructure 3 may have a height less than that of the ceramic layer.

In addition, the metal nanostructure 3 may have a height of 2 μm orless, which is smaller than a thickness of the ceramic layer 1, in orderto prevent the short circuit.

Further, the metal nanostructure 3 is not limited in terms of a shapethereof. For example, the metal nanostructure 3 may be cylindrical shapeand have a star shaped cross section.

Particularly, when the metal nanostructure 3 is cylindrical shape havinga star shaped cross section, a surface area of the metal nanostructure 3is further increased to thereby allow for the further increase ofcapacitance. In addition, the metal nanostructure 3 may be made of anymaterial as long as it is a general metal; however, it may be made of amaterial the same as that of the metal layer 2.

According to an embodiment of the present invention, since the ceramicsheet product 10 includes the metal nanostructures 3 made of the samekind of material as that of the metal layer 2, the surface area ofmetals may be increased. Particularly, in order to maximize capacitance,the metal nanostructure 3 may be made of a material the same as that ofthe metal layer 2.

Meanwhile, positions in which the metal nanostructures 3 are formed arenot specially limited. For example, in the case of stacking severallayers of the ceramic sheet product 10, the metal nanostructures 3 maycontact each of the metal layers 2 formed on upper and lower portions ofthe ceramic layer 1 and protrude from each of the metal layers 2 to theinner portion of the ceramic layer 1.

In this case, in order to prevent a short circuit, the metalnanostructures 3 should not contact each other in the inner portion ofthe ceramic layer 1.

The ceramic sheet product 10 for a ceramic electronic componentaccording to an embodiment of the present invention may include themetal nanostructure 3 protruding from the metal layer 2 to the innerportion of the ceramic layer 1, such that an interval between the metallayers may be reduced to allow for the increase of capacitance, in thecase of stacking several layers of the ceramic sheet product 10.Capacitance may be obtained from the following Equation.

$\begin{matrix}{C = {ɛ_{0}ɛ_{r}\frac{A}{d}}} & \lbrack{Equation}\rbrack\end{matrix}$

Where C indicates capacitance, ∈ indicates permittivity, A indicates asurface area of a metal, and d indicates an interval between metallayers.

That is, it may be appreciated from the above Equation that the more theinterval d between the metal layers is reduced and the surface area A ofthe metal is increased, the more capacitance is increased.

Therefore, according to an embodiment of the present invention, in thecase of stacking several layers of the ceramic sheet product, theinterval between the metal layers is reduced, such that the capacitancemay be increased.

FIG. 2 is a view showing a process of manufacturing a ceramic sheetproduct for a ceramic electronic component according to an embodiment ofthe present invention.

FIG. 3 is a flowchart showing a process of manufacturing a metalnanostructure according to an embodiment of the present invention.

Referring to FIGS. 2 and 3, a method of manufacturing a ceramic sheetproduct for a ceramic electronic component according to an embodiment ofthe present invention may include preparing metal nanostructures 13(S1); transferring the metal nanostructures 13 to a ceramic green sheethaving a ceramic layer formed thereon so as to protrude to an innerportion of the ceramic layer (S2); and forming a metal layer on theceramic green sheet so as to contact the metal nanostructures (S3).

In the method of manufacturing a ceramic sheet product for a ceramicelectronic component according to an embodiment of the presentinvention, the metal nanostructures may be prepared by patterning apolymer matrix 12 through a nanoimprinting method and then growing themetal nanostructures (S1).

A flowchart of a process of preparing the metal nanostructures 13 isshown in FIG. 3.

Referring to FIG. 3, the process of preparing the metal nanostructuresmay be performed by the nanoimprinting method.

More specifically, the polymer matrix 12 may be coated on a surface of asubstrate 11.

The polymer matrix 12 may be not specially limited but may be, forexample, polymethylmethacrylate (PMMA).

Next, the polymer matrix on the surface of the substrate may bepatterned by a nanoimprint lithography (NIL) technology.

More specifically, the polymer matrix may be pressed at a high pressureby a concave and convex-shaped stamp at a temperature of 140 to 180° C.,which is a high temperature corresponding to a glass transitiontemperature or more of the PMMA, and be then cooled to 100° C. or lessto thereby be separated from the stamp.

Therefore, nano patterns formed on the polymer matrix 12 are transferredonto the substrate in the form of an intaglio in which the concave andconvex shape of the stamp is reflected.

Then, the metal nanostructures 13 may be grown by uniformly forming atleast one material among silver (Ag), lead (Pb), platinum (Pt), nickel(Ni), copper (Cu) and the like or a mixture of at least two thereof overan upper surface of the substrate 11.

A method for growing the metal nanostructures 13 may not be speciallylimited. For example, the metal nanostructures 13 may be grown by anelectrochemical method or a deposition method.

Thereafter, through thermosetting and etching processes, the portion ofthe polymer matrix 12, on which the nano patterns are not formed, may beremoved.

As a result, the metal nanostructures 13 formed on the substrate 11 maybe prepared.

FIG. 4A is a scanning electron microscope (SEM) photograph of a polymermatrix after a nano imprint lithography (NIL) process; and FIGS. 4B and4C are SEM photographs of metal nanostructures after the NIL process.

A SEM image after the NIL process is performed on the polymer matrix onthe substrate is shown in FIG. 4A. It may be appreciated from FIG. 4Athat the nano patterns are transferred in the form of an intaglio to thepolymer matrix.

In addition, SEM images in which the metal nanostructures are formed onthe substrate are shown in FIGS. 4B and 4C.

Next, the metal nanostructures 13 may be transferred to the ceramicgreen sheet having the ceramic layer formed thereon so as to protrude tothe inner portion of the ceramic layer (S2).

The ceramic green sheet having the ceramic layer formed thereon may bemanufactured by a known method.

Since the metal nanostructures 13 are previously designed and formed tohave a height less than that of the ceramic layer, they do not contact alower carrier film having the ceramic layer formed thereon.

Thereafter, the substrate 11 is removed, whereby the ceramic green sheethaving the metal nanostructures 13 protruding to the inner portion ofthe ceramic layer may be prepared.

Next, the metal layer may be formed on the ceramic green sheet so as tocontact the metal nanostructures (S3).

The metal layer may be formed by a general method. For example, themetal layer may be formed by dispensing a conductive paste and moving asqueegee in one direction.

Characteristics of the ceramic sheet product according to the embodimentof the present invention, except for the method for manufacturing theceramic sheet product, are the same as those of the ceramic sheetproduct according to the predescribed embodiment of the presentinvention.

FIG. 5 is a perspective view schematically showing a multilayer ceramiccapacitor according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view of the multilayer ceramic capacitortaken along line B-B′ of FIG. 5.

Referring to FIGS. 5 and 6, a multilayer ceramic electronic componentaccording to an embodiment of the present invention may include aceramic body 5 having a plurality of dielectric layers 1 and a pluralityof internal electrode layers 2, alternately stacked therein; metalnanostructures 3 contacting the internal electrode layers 2 andprotruding from the internal electrode layers 2 to inner portions of thedielectric layers 1; and external electrodes 6A and 6A formed on endsurfaces of the ceramic body 5 and electrically connected to theinternal electrodes.

Hereinafter, a multilayer ceramic electronic component according to anembodiment of the present invention, particularly, a multilayer ceramiccapacitor 100 will be described. However, the present invention is notlimited thereto.

In addition, the ceramic layer of the ceramic sheet product will berepresented as a dielectric layer in a multilayer ceramic electroniccomponent, and the metal layer of the ceramic sheet product willrepresented as an internal electrode layer in the multilayer ceramicelectronic component. The ceramic layer and the dielectric layer or themetal layer and the internal electrode layer are only differentrepresentations for the same object.

The multilayer ceramic capacitor 100 according to an embodiment of thepresent invention may include the ceramic body 5 having the plurality ofdielectric layers 1 and the plurality of internal electrode layers 2,alternately stacked therein; and the external electrodes 6A and 6Aformed on the end surfaces of the ceramic body 5 and electricallyconnected to the internal electrodes.

Particularly, the multilayer ceramic capacitor 100 according to anembodiment of the present invention may include the metal nanostructures3 contacting the internal electrode layers 2 and protruding from theinternal electrode layers 2 to the inner portions of the dielectriclayers 1.

As shown in FIG. 6, the ceramic body 5 may include the metalnanostructures 3 as well as the plurality of dielectric layers 1 and theplurality of internal electrode layers 2 stacked therein.

Therefore, an interval between the internal electrodes may be reduced tothereby allow for the increase of capacitance.

That is, according to an embodiment of the present invention, the metalnanostructures 3 contacting the internal electrode layers 2 andprotruding from the internal electrode layers 2 to the inner portions ofthe dielectric layers 1 are formed in interfaces between the dielectriclayers 1 and the internal electrode layers 2, and the dielectric layers1 and the internal electrode layers 2 are alternately stacked, wherebythe multilayer ceramic capacitor having high capacitance may beprovided.

A height, a material, a shape of the metal nanostructure 3 are the sameas those of the above-mentioned ceramic sheet product. Therefore, adescription thereof will be omitted.

In addition, a material, a thickness, or the like, of the dielectriclayer and the internal electrode layer are not specially limited but arethe same as those of the above-mentioned ceramic sheet product.

FIG. 7 is a view showing a process of manufacturing a multilayer ceramiccapacitor according to an embodiment of the present invention.

Referring to FIG. 7, a method of manufacturing a multilayer ceramicelectronic component according to an embodiment of the present inventionmay include preparing metal nanostructures; transferring the metalnanostructures to a ceramic green sheet having a dielectric layer formedthereon so as to protrude to an inner portion of the dielectric layer;forming an internal electrode layer on the ceramic green sheet so as tocontact the metal nanostructures; forming a laminate by stacking theceramic green sheets in which the dielectric layer, the internalelectrode layer formed on the dielectric layer, and the metalnanostructures contacting the internal electrode layer and protruding tothe inner portion of the dielectric layer are formed; manufacturing agreen chip by compressing and cutting the laminate; and manufacturing aceramic body by firing the green chip.

Hereinafter, a description for portions overlapped with the descriptionfor the method of manufacturing a ceramic sheet product according to thepredescribed embodiment of the present invention will be omitted and amethod of manufacturing a multilayer ceramic electronic component,particularly, a multilayer ceramic capacitor, will be described.

First, a plurality of green sheets each including the ceramic layer 1the metal layer 2 formed on the ceramic layer 1, and the metalnanostructures 3 contacting the metal layer 2 and protruding from themetal layer 2 to the inner portion of the ceramic layer 1 are prepared.

Each of the plurality of green sheets is separated from the carrier film4 and then the separated green sheets are stacked to be overlapped,thereby forming a green sheet laminate.

Then, the green sheet laminate may be compressed at a high temperatureand a high pressure and then cut to have a predetermined size through acutting process, thereby manufacturing a capacitor body.

Thereafter, the multilayer ceramic capacitor is completed by theperforming of a baking process, a firing process, a polishing process,an external electrode forming process, a plating process, and the like.

Hereafter, the present invention will be described in detail withreference to Comparative Example and Inventive Example; however, it isnot limited thereto.

A multilayer ceramic capacitor (Inventive Example) according to anembodiment of the present invention and a multilayer ceramic capacitor(Comparative Example) according to the related art were manufactured asdescribed below.

In Inventive Example, a polymer matrix on a surface of a substrate onwhich a PMMA is first coated was patterned by a NIL technology.

Then, a nickel metal was applied to the patterned surface by adeposition method, grown, and then subjected to thermosetting andetching processes, thereby forming metal nanostructures having a heightof 400 nm.

Next, a ceramic green sheet in which a ceramic layer having a thicknessof 600 nm is formed was prepared and the metal nanostructures were thenformed on the ceramic green sheet by a screen printing method so as toprotrude to an inner portion of the ceramic layer.

The ceramic layer was formed by a general method using barium titanate(BaTiO₃) powders, and the metal nanostructures had a height less thanthat of the ceramic layer, such that the metal nanostructures did notcontact a lower carrier film having the ceramic layer formed thereon.

Thereafter, the substrate was removed and a metal layer was formed onthe ceramic green sheet by a general method so as to contact the metalnanostructures.

The metal layer was formed by applying a conductive nickel paste, whichis the same material as those of the nickel nanostructures protruding tothe inner portion of the ceramic layer, and was contacted the nickelnanostructures.

The ceramic green sheets were stacked and were then subjected toprocesses such as a compressing process, a cutting process, a firingprocess, or the like, thereby manufacturing the multilayer ceramiccapacitor according to an embodiment of the present invention.

The multilayer ceramic capacitor according to the Comparative Example isthe same as the multilayer ceramic capacitor according to the relatedart, and does not include metal nanostructures. The multilayer ceramiccapacitor according to the Comparative Example was manufactured underthe same conditions as those of an Inventive Example in terms of otherconditions such as a size, a thickness, or the like, of the multilayerceramic capacitor.

In the multilayer ceramic capacitors according to the Inventive Exampleand the Comparative Example, individual single units, of which athickness of a dielectric layer is 600 nm, a thickness of an internalelectrode layer is 1 μm, a width is 600 nm, and a length is 2 mm wereseparated and simulated, whereby capacitances of individual single unitsare compared.

In the case of Inventive Example, the nickel nanostructures having athickness of 400 nm and protruding to the inner portion of thedielectric layer having a thickness of 600 nm were formed to protrudefrom an interface between the dielectric layer and the internalelectrode layer to the inner portion of the dielectric layer.

The simulation was performed so as to finally calculate thecapacitances, starting with the following Equation.

$\begin{matrix}{{{Q = {CV}},{W = {\frac{1}{2}{CV}^{2}}},{C = \frac{2\; W}{V^{2}}}}{W = {\frac{1}{2}{\int{ɛ_{0}ɛ_{r}E^{2}{v}}}}}} & \lbrack{Equation}\rbrack\end{matrix}$

In the above Equation, W indicates energy density, E indicates anelectric field, dv indicates a differential volume component, and ∈indicates permittivity.

As a calculation result of the above Equation with respect to anapplication voltage of 0.1 V, W of 1.77×10⁻¹⁴[J] was obtained in thecase of the Comparative Example and W of 5.12×10⁻¹⁴[J] was obtained inthe case of the Inventive Example.

A result obtained by substituting the above mentioned W values for theabove Equation is provided in the following Table 1.

TABLE 1 $C = \frac{2\; W}{V^{2}}$ Capacitance [F] Comparative Example2 × 1.77 × 10⁻¹⁴/0.1²  3.54 × 10⁻¹² Inventive Example 2 × 5.12 ×10⁻¹⁴/0.1² 10.23 × 10⁻¹²

It may be appreciated from the above simulation result that themultilayer ceramic capacitor according to the Inventive Example hascapacitance increased by 290%, as compared to that of the ComparativeExample.

Therefore, it may be appreciated that the multilayer ceramic capacitoraccording to the embodiment of the present invention has a reduceddistance between the electrodes, to thereby allow for the increase ofcapacitance, as compared to the multilayer ceramic capacitor accordingto the related art.

As set forth above, with the ceramic sheet product for a ceramicelectronic component and the high capacitance ceramic electroniccomponent using the same according to the embodiments of the presentinvention, the interval between the internal electrodes is reduced tothereby allow for the increase of capacitance.

While the present invention has been shown and described in connectionwith the exemplary embodiments, it will be apparent to those in the artthat modifications and variations can be made without departing from thespirit and scope of the invention as defined by the appended claims.Accordingly, various substitution, modifications and alteration may bemade within the scope of the present invention may be made by thoseskilled in the art without departing from the spirit of the preventinvention defined by the accompanying claims.

1. A ceramic sheet product for a ceramic electronic component, theceramic sheet product comprising: a ceramic layer; a metal layer formedon the ceramic layer; and metal nanostructures contacting the metallayer and protruding from the metal layer to an inner portion of theceramic layer.
 2. The ceramic sheet product of claim 1, wherein themetal nanostructures have a height less than that of the ceramic layer.3. The ceramic sheet product of claim 1, wherein the metalnanostructures are cylindrical.
 4. The ceramic sheet product of claim 1,wherein the metal nanostructures have a star shaped cross section. 5.The ceramic sheet product of claim 1, wherein the metal nanostructuresare made of the same kind of material as that of the metal layer.
 6. Amethod of manufacturing a ceramic sheet product for a ceramic electroniccomponent, the method comprising: preparing metal nanostructures;transferring the metal nanostructures to a ceramic green sheet having aceramic layer formed thereon so as to protrude to an inner portion ofthe ceramic layer; and forming a metal layer on the ceramic green sheetso as to contact the metal nanostructures.
 7. The method of claim 6,wherein the metal nanostructures have a height less than that of theceramic layer.
 8. The method of claim 6, wherein the preparing of themetal nanostructures includes patterning a polymer matrix through ananoimprinting method and growing the metal nanostructures.
 9. Themethod of claim 8, wherein the growing of the metal nanostructures isperformed by an electrochemical method or a deposition method.
 10. Themethod of claim 6, wherein the metal nanostructures are made of the samekind of material as that of the metal layer.
 11. A multilayer ceramicelectronic component comprising: a ceramic body having a plurality ofdielectric layers and a plurality of internal electrode layers,alternately stacked therein; metal nanostructures contacting theinternal electrode layers and protruding from the internal electrodelayers to inner portions of the dielectric layers; and externalelectrodes formed on end surfaces of the ceramic body and electricallyconnected to the internal electrodes.
 12. The multilayer ceramicelectronic component of claim 11, wherein the metal nanostructures havea height less than that of the dielectric layers.
 13. The multilayerceramic electronic component of claim 11, wherein the metalnanostructures are cylindrical.
 14. The multilayer ceramic electroniccomponent of claim 11, wherein the metal nanostructures have a starshaped cross section.
 15. The multilayer ceramic electronic component ofclaim 11, wherein metal nanostructures are made of the same kind ofmaterial as that of the internal electrode layers.
 16. A method ofmanufacturing a multilayer ceramic electronic component, the methodcomprising: preparing metal nanostructures; transferring the metalnanostructures to a ceramic green sheet having a dielectric layer formedthereon so as to protrude to an inner portion of the dielectric layer;preparing an internal electrode layer on the ceramic green sheet so asto contact the metal nanostructures; forming a laminate by stackingseveral layers of the ceramic green sheet in which the dielectric layer,the internal electrode layer formed on the dielectric layer, and themetal nanostructures contacting the internal electrode layer andprotruding to the inner portion of the dielectric layer are formed;manufacturing a green chip by compressing and cutting the laminate; andmanufacturing a ceramic body by firing the green chip.
 17. The method ofclaim 16, wherein the metal nanostructures have a height less than thatof the dielectric layer.
 18. The method of claim 16, wherein thepreparing of the metal nanostructures includes patterning a polymermatrix through a nanoimprinting method and growing the metalnanostructures.
 19. The method of claim 18, wherein the growing of themetal nanostructures is performed by an electrochemical method or adeposition method.
 20. The method of claim 16, wherein the metalnanostructures are made of the same kind of material as that of theinternal electrode layer.